6 Inch Silicon Wafer CZ P Type Boron Doped Orientation 100 Prime Grade 6"
PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, range from the silicon substrate to compound semiconductor, PAM-XIAMEN offer semiconductor silicon substrate with diameters from 1’’ (25.4 mm) to 12’’ (300 mm). We work either Cz (Czochralski) or FZ (Float Zone) silicon substrate. The polishing process is also made according to SEMI standard( the Semiconductor Equipment and Materials International standards). We also work ultra thin wafer, silicon oxide wafer SiO2 thin film, silicon nitride wafer Si3N4 thin film, metallization on silicon substrate, and epi wafer service.
6inch Silicon Wafer CZ P Type Boron Doped Orientation 100 Prime Grade 6"
| Type |
Conduction Type |
Orientation |
Diameter(mm) |
Resistivity(Ω•cm) |
| CZ |
N&P |
<100><110>&<111> |
50-300 |
1-300 |
| MCZ |
N&P |
<100><110>&<111> |
50-300 |
1-300 |
| Heavy-doping |
N&P |
<100><110>&<111> |
50-300 |
0.001-1 |
| Parameter |
Unit |
Value |
| Crystalline structure |
- |
Monocrystalline |
| Growth technique |
- |
CZ |
| Crystal Orientation |
- |
100 |
| Conductance type |
- |
P |
| Dopant |
- |
Boron |
| Diameter |
mm |
150 |
| Resistivity |
Ωcm |
<40 |
| Thickness |
um |
200±25µm, 525±25µm
675±25μm, 875±25μm
1000± 25µm |
| TTV |
um |
≤10 um |
| BOW |
um |
≤40 um |
| Warp |
um |
≤40 um |
| (G)STIR |
um |
Customer standard |
| Site Flatness-STIR |
um |
Customer standard |
| Edge Exclusion Zone |
mm |
SEMI STD or Customer Request |
| LPD's |
- |
≥0.3μm, <30count or Customer Request |
| Oxygen Concentration |
ppma |
<1E16/cc |
| Carbon Concentration |
ppma |
<1E16/cc |
| RRG |
- |
≤15% |
| Front Surface |
- |
Polished or Etched |
| Back Surface |
- |
Polished or Etched |
| Edge Surface Condition |
|
SEMI STD or Customer Request |
| Primary Flat Length |
mm |
SEMI STD |
| Primary Flat Orientation(100/111) & Angle(°) |
|
SEMI STD |
| Secondary Flat Length |
mm |
SEMI STD |
| Secondary Flat Orientation(100/111) & Angle(°) |
|
SEMI STD |
| Laser mark |
- |
SEMI STD or Customer Request |
| Packaging |
|
Packaged in a class 100 clean room environment,
Heat-sealed plastic inner/aluminium foil outer bags,
Vacuum Packing |
| If specific requirement by customer, will adjust accordingly |
What is Silicon Wafer Used For?
Silicon wafer’s primary use is in integrated circuits. Integrated circuits power many of the devices that modern society uses every day. Computers and smartphones are just two of the devices that are dependent on this technology. Although other semiconductors have been tested overtime, silicon has proved to be stable option. Other uses include sensors, such as the tire pressure sensor system, and solar cells. Silicon wafers absorb the photons in sunlight and this in turn create electricity.
PAM-XIAMEN can offer you technology and wafer support, for more information, please visit our website: https://www.powerwaywafer.com,
send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com
Quality is our first priority. PAM-XIAMEN has been ISO9001:2008, owns and shares four modern facories which can provide quite a big range of qualified products to meet different needs of our customers, and every order has to be handled through our rigorous quality system. Test report is provided for each shipment, and each wafer are warranty.Before 1990, we are stated owned condensed matter physics research center. In 1990, center launched Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN), now it is a leading manufacturer of compound semiconductor material in China.
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